MEMS and Nanotechnology, Volume 5 Proceedings of the 2013 Annual Conference on Experimental and Applied Mechanics /

Detalles Bibliográficos
Otros autores o Colaboradores: Shaw III, Gordon (ed.), Prorok, Barton C (ed.), Starman, LaVern (ed.), Furlong, Cosme (ed.)
Formato: Libro
Lengua:inglés
Datos de publicación: Cham : Springer International Publishing : Imprint: Springer, 2014.
Series:Conference Proceedings of the Society for Experimental Mechanics Series,
Temas:
Acceso en línea:http://dx.doi.org/10.1007/978-3-319-00780-9
Resumen:MEMS and Nanotechnology, Volume 5: Proceedings of the 2013 Annual Conference on Experimental and Applied Mechanics, the fifth volume of eight from the Conference, brings together contributions to this important area of research and engineering.  The collection presents early findings and case studies on a wide range of areas, including:   Microelectronics Packaging Single Atom/Molecule Mechanical Testing MEMS Devices & Fabrication In-Situ Mechanical Testing Nanoindentation Experimental Analysis of Low-Dimensional Materials for Nanotechnology.
Descripción Física:viii, 134 p. : il.
ISBN:9783319007809
ISSN:2191-5644
DOI:10.1007/978-3-319-00780-9

MARC

LEADER 00000Cam#a22000005i#4500
001 INGC-EBK-000185
003 AR-LpUFI
005 20220927105708.0
007 cr nn 008mamaa
008 130917s2014 gw | s |||| 0|eng d
020 |a 9783319007809 
024 7 |a 10.1007/978-3-319-00780-9  |2 doi 
050 4 |a T174.7 
072 7 |a TDPB  |2 bicssc 
072 7 |a TEC027000  |2 bisacsh 
245 1 0 |a MEMS and Nanotechnology, Volume 5   |h [libro electrónico] : ;   |b Proceedings of the 2013 Annual Conference on Experimental and Applied Mechanics /   |c edited by Gordon Shaw III...[et al.]. 
260 1 |a Cham :  |b Springer International Publishing :  |b Imprint: Springer,  |c 2014. 
300 |a viii, 134 p. :   |b il. 
336 |a text  |b txt  |2 rdacontent 
337 |a computer  |b c  |2 rdamedia 
338 |a online resource  |b cr  |2 rdacarrier 
347 |a text file  |b PDF  |2 rda 
490 1 |a Conference Proceedings of the Society for Experimental Mechanics Series,  |x 2191-5644 
505 0 |a From the Contents: Warpage Measurement of Simulated Electronic Packaging Assembly -- Nanomechanical Characterization of Lead Free Solder Joints -- In-Situ Surface Mount Process Characterization Using Digital Image Correlation -- Acoustic Waveform Energy as an Interconnect Damage Indicator -- Shape Optimization of Cantilevered Piezoelectric Devices -- Unique Fabrication Method for Novel MEMS Micro-contact Structure -- A Frequency Selective Surface Design Fabricated With Tunable RF Meta-atoms -- Stress Characterization in Si/SiO2 Spherical Shells Used in Micro-Robotics. 
520 |a MEMS and Nanotechnology, Volume 5: Proceedings of the 2013 Annual Conference on Experimental and Applied Mechanics, the fifth volume of eight from the Conference, brings together contributions to this important area of research and engineering.  The collection presents early findings and case studies on a wide range of areas, including:   Microelectronics Packaging Single Atom/Molecule Mechanical Testing MEMS Devices & Fabrication In-Situ Mechanical Testing Nanoindentation Experimental Analysis of Low-Dimensional Materials for Nanotechnology. 
650 0 |a Engineering.  |9 259622 
650 0 |a Mechanics.  |9 260044 
650 0 |a Nanotechnology.  |9 259892 
650 2 4 |a Microengineering.  |9 259893 
700 1 |a Shaw III, Gordon,   |e ed.  |9 260372 
700 1 |a Prorok, Barton C,   |e ed.  |9 260373 
700 1 |a Starman, LaVern,   |e ed.  |9 260374 
700 1 |a Furlong, Cosme,   |e ed.  |9 260375 
776 0 8 |i Printed edition:  |z 9783319007793 
856 4 0 |u http://dx.doi.org/10.1007/978-3-319-00780-9 
912 |a ZDB-2-ENG 
929 |a COM 
942 |c EBK  |6 _ 
950 |a Engineering (Springer-11647) 
999 |a SKV  |c 27613  |d 27613